Accelerating Semiconductor Processes Control with Advanced 3D Optical Metrology

In this webinar, we present case studies that address improving yield, identifying root cause failure and driving next generation device development from bare wafer to final packaged device.

Recent advances in 3D Optical Metrology accelerate in-line quality control for both front and back end processes. In this webinar, we present case studies that address improving yield, identifying root cause  failure and driving next generation device development from bare wafer to final packaged device.

We will highlight requirements for advanced telecommunication, compact on-board electronics, and electric vehicles covering metrology needs for denser interconnect networks, finer redistribution layer (RDL), direct wafer to wafer bonding and wafer fan-out packaging.

Front end (FEOL) examples will include:

  • Wafer bin roughness and edge roll-off
  • CMP efficiency full die flatness
  • CD metrology including TSV, deep trench RIE (Bosch process)
  • Epi layer defect quantification in high power devices


Back end (BEOL) and packaging examples will address:

  • Under Bump Metallization (UBM)
  • Recess defect inspection
  • Full die screening for dense interconnect control

Who Should Attend?

This 45 minute interactive webinar will include a Q&A session. It will be valuable for Process Engineers, CMP Engineers, Metrology & Quality Engineers, as well as R&D scientists working across semiconductor, micro-electronics, display technology, printed electronics and telecoms industries.

Speakers

Samuel Lesko

Bruker (USA)

Senior Application Development Manager

Samuel has Ph.D. and engineering degree in material science from the University of Burgundy in France. Since 2000, he built extensive experience in optical profiler, particularly in using white light interferometry applied to MEMS, semiconductor, automotive and aerospace. His vast experience and passion in correlating roughness parameters with the performance of devices or parts has aided countless researchers and engineers in both academic and industrial settings