Stylus and Optical Profilometry Webinars

Accelerating Semiconductor Processes Control with Advanced 3D Optical Metrology

Learn how recent advances in 3D Optical Metrology accelerate in-line quality control for both front- and back-end processes


Semiconductor manufacturing is subject to increastingly strict tolerances, making fast, precise front- and back-end process control a critical part of device and component production.

This webinar focuses on case studies demonstrating the use of 3D optical profilers for improving yield, identifying root cause failure, and driving next-generation device development from bare wafer to final packaged device.

Viewers can expect to gain new insight into bare wafer roughness control and CMP monitoring and optimization as well as the use of direct measurement of topography to assess die flatness and identify the source of RDL, bump, recess, and overlay defects.


Find out more about the technology featured in this webinar or our other solutions for semiconductor process control:

Recorded on December 17, 2018

Explore Advanced Process Control Techniques for Semiconductor Manufacturing

Designed for Process, CMP, and Metrology & Quality Engineers as well as R&D scientists working in semiconductor, micro-electronics, display technology, printed electronics, and telecoms industries, we cover requirements and metrology needs for:

  • Advanced telecommunication;
  • Compact on-board electronics;
  • Electric vehicles;
  • Denser interconnect networks;
  • Finer redistribution layer (RDL);
  • Direct wafer to wafer bonding; and
  • Wafer fan-out packaging.

Among the included case studies, front end (FEOL) examples will include:

  • Wafer bin roughness and edge roll-off;
  • CMP efficiency full die flatness;
  • CD metrology including TSV, deep trench RIE (Bosch process); and
  • Epi layer defect quantification in high power devices.

Back end (BEOL) and packaging examples will address:

  • Under Bump Metallization (UBM);
  • Recess defect inspection; and
  • Full die screening for dense interconnect control.

Speakers

Samuel Lesko, Ph.D.
Dir. of Technology and Apps Development for Tribology, Stylus & Optical Profilers, Bruker

 

Samuel has Ph.D. and engineering degrees in material science from the University of Burgundy in France. Since 2000, he has built extensive experience in optical profiling technology, particularly in using white light interferometry applied to MEMS, semiconductor, automotive and aerospace applications. His vast experience and passion in correlating roughness parameters with the performance of devices or parts has aided countless researchers and engineers in both academic and industrial settings.