Ball bonding is a type of wire bonding commonly used for electrical interconnections in semiconductor devices. A weld is created between the gold ball and the surface of the chip using heat, static pressure and ultrasonic energy.
Optimum bonding settings are tricky to design because of the interactions between process variables. EBSD analysis on wire bonding is the perfect tool to help understand device failure by identifying structural changes or deformation at metal interconnects. Combined EDS/EBSD analysis enables: