Bruker’s Hysitron TI Premier nanoindenter was specifically designed to deliver industry-leading, quantitative nanomechanical characterization within a compact platform. Built upon proven Hysitron technology, the TI Premier provides a broad suite of nanoscale mechanical and tribological testing techniques. Routine measurements to advances research can be accomplished utilizing the versatile base configurations of TI Premier, while numerous technique upgrade options are available to meet the demands of your future characterization needs.
Proprietary capacitive transducer technology provides exceptional measurement noise floors (75 nN, <0.2 nm), accuracy, and reliability during the nanoindentation process. Electrostatic actuation uses little current, enabling superior drift characteristics that result in faster data acquisition, higher accuracy, and better repeatability.
Bruker has developed a broad suite of complementary characterization techniques to enable powerful nanoscale materials research.
Dynamic Mechanical Analysis: Storage modulus, loss modulus, and tan delta as a function of measurement depth, frequency, and time.
Tribology: Friction Coefficients, scratch resistance, thin film adhesion, and nanoscale wear.
Surface Characterization: In-situ scanning probe microscopy, optical microscopy, and surface mechanical property mapping.
Electrical Characterization: In-situ electrical contact resistance, conductance, phase transformations, and material deformation behavior.
Environmental Control: Nanomechanical and nanotribological characterization at high temperatures and in customizable gaseous atmospheres.
Bruker’s Hysitron TI Premier offers application-specific characterization packages tailored for quasi-static nanoindentation, dynamic characterization, high temperature characterization, and testing over multiple length scales. These prepackaged configurations are optimized to deliver dedicated solutions to meet your research and process control requirements.
Quasi-Static Nanoindentation Package: Nanomechanical characterization optimized for thin films and inhomogeneous materials.
Dynamic Characterization Package: Quasi-static and dynamic mechanical property characterization over a broad range of materials, from ultrasoft to ultrahard.
High-Temperature Characterization Package: Investigate mechanical properties and time-dependent deformation behavior as a function of temperature.
Multiple Length Scales Package: Depth-sensing indentation over the nanometer and micrometer length scales.