This white paper focuses on the optimization and use of Bruker’s iTF software package for the extraction of intrinsic (substrate independent) mechanical properties, particularly for thin, low-k materials. These considerations are split into two main parts: Measurement procedure (Section II) and iTF execution (Section III). The former outlines important aspects of acquiring proper experimental data, which is later fed into the iTF software. It should be noted that the reader is assumed to have a preliminary understanding of the Li-Vlassak solution and basic nanoindentation principles.
KEYWORDS: Mechanical Property Characterization; Nanoindentation for Semiconductor Research; Thin Film Metrology; Quasistatic Indentation
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