High-resolution automated in-line X-Ray inspection (XRI) system
On the leading edge of a new category of in-line transmissive inspection and metrology equipment, the X200 XRI system brings front-of-line semiconductor fab-like inspection to the backend manufacturing line. The system uses proprietary data collection architecture, industry-leading data processing, and innovative machine learning techniques to provide fully automatic, fast, 100% inspection and real-time feedback on user-defined regions of interest. Designed for continuous use on the manufacturing floor and able to inspect a range of semiconductor components—including singulated units, strips, boats, wafers, and film frames—the X200 provides the unique capabilities manufacturers need to meet increasingly stringent customer requirements and regulatory standards. The X200 XRI system is ideal for a range of semiconductor applications, from advanced packaging and system in a package (SiP) production to 2.5D and 3D integrated circuit chip (IC) integration and power component manufacturing.
With advanced instrumentation and proprietary system architecture and processing techniques, X200 enables uniquely precise quantification, calculation, location, and interpretation of feature surface characteristics, defects, and variation.The system also provides comprehensive data and record management.
This is accomplished through:
Advances in semiconductor packaging continue to enable higher performance in electronic components. With advanced packaging comes tighter tolerances, smaller interconnects, and more vertical layers. Together with increasingly stringent quality and reliability requirements from system manufacturers, these trends have exposed the limitations of existing inspection and metrology techniques.
The X200's technology was developed to quickly and precisely identify small changes in device interconnect structures and to provide real-time feedback for process control and screening.
Instead of pulling a small sample from your manufacturing line for lengthy and data-limited 3D X-ray and cross-sectioning, you can automatically monitor 100% of your production in real-time and achieve new levels of quality, reliability, and production yield.
The Internet of Things is putting complex electronic systems into products we interact with every day. While conventional surface-mount area array components are routinely 100% inspected with printed circuit board assembly (PCBA) XRI, these tools lack the resolution and sensitivity to inspect the smaller feature-size conductors in SiP.
However, Bruker’s X200 XRI technology allows high-speed 100% inspection and metrology at the micron scale. With high sensitivity and machine learning-based inspection algorithms, X200 automatically inspects SiP products to rapidly detect process variation and screen defects, such as non-wet solder joints, bridging, and voids.
Devices in artificial intelligence, high-speed networking, and other processing-intensive markets are moving to 2.5D and 3D package architecture to achieve high memory bandwidth and increased data transfer rates. Vertical integration compels manufacturers to use transmissive inspection techniques to monitor their processes, however, conventional point projection high-resolution X-ray lacks the speed and sensitivity to provide adequate in-line control.
X200’s algorithms acquire massive data sets in seconds with full resolution across the full field of view. Using advanced machine learning algorithms, thousands of solder joints are immediately characterized and evaluated. Detailed heat maps and intelligent outlier detection informs manufacturing process control and screens out defective interconnects.
Power electronics are proliferating rapidly in electric and autonomous vehicles. These systems are particularly intolerant to faults and defective components, yet the structure of power components (heat sinks, aluminum wire, solder die attach, etc.) make traditional transmissive inspection techniques difficult or impossible.
X200’s proprietary, high-power X-ray source technology has the sensitivity to collect rich data sets from power devices, and thus provide manufactures the ability to meet the most demanding automotive quality requirements.
The X200 Data Analysis Toolkit revolutionizes the use of transmissive inspection technology in semiconductor packaging by eliminating manual processing and interpretation of X-ray images and letting image processing-based algorithms identify defective units.
X200’s proprietary analysis tools locate and analyze features of interest using machine learning techniques in real time as the system captures data from samples under test.
Supervised model learning can be accomplished on limited sample sizes to progress more quickly to production. With the addition of supervised learning from programmed defects or offline analyses, process control and reject detection criteria can be tuned to the user’s unique application specifications.
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.