X-ray diffraction imaging (XRDI) inspection system
The Bruker QC-TT is a defect metrology system using the latest X-ray diffraction imaging (XRDI) technology for the most comprehensive crystallographic defect inspection solution. The QC-TT is used to analyze Si wafer and ingot quality for the presence of defects and cracks within wafer. With zero edge exclusion, even defects on the bevel edge and the notch can be identified automatically. Due to the nature of the X-ray diffraction, and unlike optical techniques, the wafer does not need to be etched or polished to be able to see the defects.
A main application of the tool is by Si wafer manufacturers. Here it can be used early in the process on ingot slices before the slices are polished. This allows earlier detection of slip and other harmful defects within the ingot, and to decide where on the ingot to start slicing for good wafers.
The Bruker QC-TT is also used for SiC monitoring. A key issue in the manufacturing process of SiC are the different defects that can be grown into the ingot. The QC-TT can be used to detect and classify these defects into the key types required by manufacturers: threading edge (TED), threading screw (TSD) and basal plane (BPD) defects. This detection can be done automatically as part of the measurement process.
How Can We Help?
Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.