Designed for a variety of thin-film applications
The Bruker JV-DX is the latest generation of X-ray metrology system for semiconductor thin film analysis for materials’ research, process development and quality control. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution XRD (HRXRD) and X-ray reflectivity modes without user intervention. Measurements are fully automated within recipes with the ability to also perform more esoteric measurements in semi-manual mode. An additional XRF module is available as an option for sub-100µm beam size measurements on metal films.
The instrument is designed for a variety of thin-film applications, including high resolution rocking curves, reciprocal space mapping, X-ray reflectivity, Grazing Incidence XRD, Phase ID, residual stress, film texture and grain size analysis, and XRF.
The sample stage consists of a robust 5-axis Eulerian cradle, with full 300 mm wafer mapping, and capacity for both large and small samples. Multiple sample locations for smaller samples are provided to enable multiple measurements across multiple samples to be queued and performed automatically, even of different measurement types.
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Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.
Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.