SIRIUS-RF
Fourth generation system to provide industry standard reliability
Sirius-RF
The Sirius-RF is the fourth generation system in a mature platform to provide industry standard reliability, ease-of-use, fab automation, and SEMI standard compliance.
Convergent Beam
XRR
Offers fast, first-principle thickness and density measurements on scribe-lines
Dual Source
µXRF configuration
Delivers flexibility and best performance for a variety of layers per device
Multi-Stack
measurement capability
Composition and thickness measurements on metrology pads or directly on-device in a non-destructive manner
Sirius-RF Features
- Convergent beam XRR for fast, first-principle thickness and density measurements on scribe-lines
- Dual source µXRF configuration for flexibility and best performance for variety of layers per device
- For advanced memory (DRAM, PCRAM, 3D-NAND, MRAM), Logic, power devices and packaging
- Composition and thickness measurement
- On metrology pads or directly on-device (non-destructive manner)
- Multi-stack measurement capability
Application Example: PCRAM
- Composition and thickness of the memory element (GeSbTe - GST) and Ovonic Threshold Switch (OTS, GeAsSe) are critical parameters
- Sirius-RF µXRF allows in-line composition monitoring on metrology pads or device areas
- Fast convergent beam XRR allows thickness measurement at 1-2 seconds per point.
