SIRIUS-FW
Fully automated µXRF metrology platform for advanced wafer level packaging
Sirius-FW
The Sirius-FW is a fourth generation, fully automated µXRF metrology platform that offers specialized single-bump metrology to monitor %Ag in SnAg solder bumps and under bump metalization. Its mature technology boasts a field proven uptime greater than 95%. The Sirius-FW system is capable of measuring single solder bumps as small as 10µm diameter with sub-micron positioning accuracy. Its automated intensity correction (AIC) ensures long-term stability and drift elimination. As would be expected for a production tool, the Sirius-FW is recipe driven and supports full fab automation.
Optimized
vertical excitation µXRF
Design configuration ideal for inline HVM metrology
<15 µm
small spot on AgKα
Results in low sensitivity to Z-errors
>95%
uptime
Fourth generation platfom with field-proven performance.
Key Features
- µXRF with vertical excitation - optimized configuration for inline, HVM metrology
- Small spot (<15 µm on AgKα)
- Low sensitivity to Z-errors
- Edge exclusion <0.5 mm
- Non-destructive with low power sealed x-ray W tube
- Polycapillary conditioning optics, polychromatic excitation
- SDD detectors array for efficient photon collection
- Quadrant collection reduces dependence on lateral errors, that is especially important when measure on a dome-shaped solder bumps
- Support of highly bent substrates (up to 2mm bending), glass substrates
Instrumental for High Yield
Sirius-FW applications are instrumental for high yield:
- %Ag in SnAg solder – key to control bumps reflow temperature, needed for regular bump shape and bonding
- Solder bump height, metal thickness of UBM (under bump metallization), back bumps, RDL (redistribution layers) and pillars height: Cu, Ni, Au, Pd Ti – key to cross-wafer planarity needed for good bonding
Benefits
- Single bump metrology for process footprint determination
- GR&R capable metrology on key applications
- Production worthy productivity and MAM (move–acquire-measure) times: seconds for metal thickness, 30-60s for %Ag and bump height
- TOR on major packaging fabs, proven stability and fleet matching