Atomic Force Profiling (AFP)

Combining the proven technologies of profiling and AFM

Chemical mechanical polishing (CMP) is used to planarize a wafer for semiconductor fabrication. As the nanofabricated structures diminish in size, planarization requirements become more stringent.

Atomic Force Profiling (AFP) is a nondestructive, high resolution technique that enables in-die measurements of surface topography (dishing and erosion) for post-CMP process control. AFP utilizes a combination of TappingMode™ and a long range profiling stage to provide AFM resolution over millimeter distances.


Featured on the following Bruker AFM:

Recommended AFM probes:

AFP profile of dishing and erosion of copper lines