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Failure Analysis

Nanomechanical Characterization in Failure Analysis

Identification of the cause of failure is a required for the improvement of existing products and the development of next-generation products. Analyses of product failure modes allow engineers to understand the impact of designs and process parameters on the reliability of the device.

Oftentimes failure is mechanical in nature, caused by intrinsic or externally applied stresses acting on the material. Design deficiencies, improper material selection, and manufacturing defects can lead to common sources of mechanical failure, such as fracture, creep, wear and fatigue.

Nanomechanical testing encompasses a powerful set of techniques to quantitatively measure the localized mechanical, tribological, and interfacial properties of materials. Nanoindentation is a highly localized testing technique that provides quantitative modulus, hardness, creep, stress relaxation, and fracture toughness measurements to be performed on small volumes of material. The high spatial resolution and mechanical property mapping capabilities of nanoindentation allow the technique to identify mechanical property gradients were the failure likely occurred. Additionally, nanoscale scratch testing provides the ability to measure localized friction and wear properties as well as thin film interfacial adhesion characterization. 

Standalone Equipment for Failure Analysis

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Instruments for Failure Analysis

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

 

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.

 

Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.