Packaging | Bruker

Packaging

Quantitative Nanomechanical Testing of Packaging Materials

Electronic packaging utilizes a broad set of materials with challenging integration issues in terms of evaluating tradeoffs between function, performance, reliability, manufacturability, and cost. Packaging materials oftentimes are multi-functional, providing a unique combination of physical function and mechanical support. Performance and reliability of packaging materials are dictated by their electrical, chemical, thermal, and mechanical characteristics. Increasing the reliability of electronic devices is accomplished by engineering new materials with unique characteristics combined with optimal package design. 

Bruker’s suite of Hysitron nanomechanical test equipment provides new insights into the mechanical properties of packaging materials. These highly sensitive and spatially resolved testing techniques provide quantitative measurement of the modulus of elasticity, hardness, fracture toughness, wear performance, adhesion, stress relaxation, and creep resistance of materials used for interconnects, substrates, dielectrics, die attach materials, electrical contacts, thermal materials, and solders. Bruker’s nanoscale measurement technologies assist in optimizing mechanical performance  for enhanced product reliability.

Standalone Test Equipment for Packaging Materials Characterization

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Test Equipment for Packaging Materials Characterization

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.

 

Hysitron PI 95 TEM PicoIndenter | Bruker

PI 95 TEM PicoIndenter

The first full-fledged depth-sensing indenter capable of direct-observation nanomechanical testing inside a transmission electron microscope (TEM).

 

Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.