Ultra-Thin Films | Bruker

Ultra-Thin Films (<50nm)

Quantifying the Unknown - Nanomechanical, Nanotribological, and Interfacial Adhesion Characterization of Ultra-Thin Films

Ultra-thin films are used in a variety of technologically advanced applications. Most ultra-thin films are grown using complex chemical and physical deposition techniques using gas-phase precursers and plasma processes. Successful integration of these films into usable products requires the ability to quantitatively measure mechanical, tribological, and interfacial properties of films only a few atomic layers thick.

Bruker is the industry leader in nanomechanical and nanotribological property characterization of ultra-thin films. Continued development of nanoindentation technologies and techniques has enabled the force sensitivity, displacement sensitivity, and control algorithms necessary for quantitative ultra-thin film measurements. Patented models remove substrate effects from the nanoindentation data to obtain intrinsic thin film modulus values.

Bruker’s nanoscratch testing technologies enables quantitative tribological and interfacial adhesion characterization of ultra- thin films. Patented electrostatic transducer technology with 2 dimensional actuation capabilities enable highly sensitive measurements of forces acting on the scratch probe during normal loading and lateral actuation, providing highly sensitive nanoscale tribological and interfacial adhesion characterization capabilities. 


Application Notes


Standalone Test Equipment for Quantitative Ultra-Thin Film Characterization

Hysitron TI 980 TriboIndenter | Bruker

TI 980 TriboIndenter

Bruker's most advanced nanomechanical and nanotribological test instrument, operating at the intersection of maximum performance, flexibility, reliability, sensitivity and speed.

Hysitron TI 950 TriboIndenter | Bruker

TI 950 TriboIndenter

Versatile nanomechanical and nanotribological test instrument, supporting a broad range of hybrid and correlative characterization techniques.

Hysitron TI Premier | Bruker

TI Premier

Dedicated nanomechanical test instruments, providing an essential toolkit for nanoscale mechanical characterization within a compact platform.

Microscope Test Equipment for Quantitative Ultra-Thin Film Characterization

Hysitron PI 85L SEM PicoIndenter | Bruker

PI 85L SEM PicoIndenter

Depth-sensing nanomechanical test instrument that can be interfaced with scanning electron microscopes (SEM).

Hysitron PI 88 SEM PicoIndenter | Bruker

PI 88 SEM PicoIndenter

Bruker’s comprehensive nanomechanical test instrument for SEM and FIB/SEM, featuring our full suite of techniques.

 

Hysitron PI 95 TEM PicoIndenter | Bruker

PI 95 TEM PicoIndenter

The first full-fledged depth-sensing indenter capable of direct-observation nanomechanical testing inside a transmission electron microscope (TEM).

 

Hysitron TS 75 TriboScope | Bruker

TS 75 TriboScope

Quantitative, rigid-probe nanoindentation and nanotribological characterization on your existing AFM.