Rhazer-III
Rhazer III
The Bruker Rhazer-III® system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is clean and dry.
Photo-Induced Defect Management (Haze Mitigation)
Photo-induced micro-contamination on photomasks (haze) has become an increasingly pervasive and costly problem throughout the semiconductor industry. Recent wet clean and environmental control techniques have helped to slow haze formation during wafer stepper exposures, but show no promise of a haze prevention solution. The Bruker Rhazer-III® system is specially designed for the wafer fab to provide an in-fab haze removal and management capability. Rhazer technology is clean and dry. Processing the mask does not require removal of the pellicle and causes no damage to the mask absorber materials and no changes to phase, transmission or CDs, meaning reticles can be cleaned as often as needed without leaving the control of the fab line.
Key Performance Features
Increased Lithography Line Efficiency:
- Dry process - no pellicle removal
- Fast turnaround - full reticle clean
- Full control - retcles never leave the wafer fab
- Fewer cleans - no haze formation in storage
Fully Automated Operation:
- SMIF & Overhead Track compatible; RFID/OCR/Barcode readers
- SECS/GEM compatible
- Robotic handling including mask flipper
- Easy to operate; highly user friendly GUI
Extends Mask Lifetime:
- No absorber damage
- No CD, phase or transmission variance
- No added chemical residues
- No limit to number of cleans
Wafer Fab Cost Savings:
- Less wasted scanner downtime waiting for masks
- Very low cost mask cleans
- Fewer duplicate masks needed
- Extended interval between defect inspections
- Reduced haze-related wafer losses
"Green" Technology:
- No acids, solvents or de-ionized water
- No harmful effluents or waste management
- Low energy consumption (7kW @ 208V AC)
- Small system footprint (1.24m x 2.31m)
Results
