WC-2200
Non-Aqueos CO₂ Cryogenic Dry Cleaning
Cryogenic Dry CO₂ Wafer Cleaning System
The Bruker Wafer Clean 2200 System removes particulate contamination and thin film organic residues from silicon, compound semiconductor, MEMS and thin film head substrates using a unique carbon dioxide (CO2) snow cleaning process. CO2 snow cleaning is fast, environmentally friendly and non-damaging. The all-dry process offers numerous advantages over conventional wet and plasma cleaning techniques. This fully automated, high volume production system is field proven with over 100 systems running 24/7 in high volume production applications around the globe.
25 WPH
Raster Scan movement
Global and local cleaning
Yield Improvement
Cleaning Efficiency down to 120nm
IBE Veil and Fence removal
Environmentally Safe
Solvent Free
ZERO Hazardous Waste