Bruker defect detection systems use X-ray diffraction imaging (XRDI) to detect crystalline defects on single-crystal substrates, such as slip, cracks, dislocations, and micropipes. Operating without the use of etching acids, our non-contact XRDI inspection systems are broadly employed to detect cracks in Si wafers that cause wafer breakage and to improve yield and quality of other high-value substrates such as GaN, CdTe, and SiC.
Bruker's X-ray diffraction imaging (XRDI) solutions support non-contact defect detection and classification for semiconductor substrates, helping manufacturers identify crystalline defects, improve yield, and maintain substrate quality across development and production environments.
Contact us to discuss your measurement requirements, find out about the systems best-suited for your application, discuss options for system specialization, or request a quote based on your specific needs.
Support process monitoring and characterization of thin-film properties across semiconductor manufacturing applications.
Identify crystalline defects in semiconductor substrates using non-contact X-ray diffraction imaging.
Support wafer quality assessment and process optimization through defect mapping and substrate inspection.
Evaluate manufacturing-related defects that influence assembly quality and device reliability.
The decision to invest in high-performance metrology is based on more than instrument performance and price. Bruker is committed to keeping your tool running at the peak of up-time and productivity. We have a highly educated worldwide team of service and support personnel that takes great pride in first-time solution of issues. Our variety of service coverage programs can be customized to match your specific requirements, including optimization of tool performance, recipe writing, and in-person technical support visits.
Bruker tailors services to your needs:
Ask us a question, request more information, or get in touch with a Bruker sales representative.