X-Ray Metrology For Silicon Semiconductors


Fully automated µXRF metrology platform for advanced wafer level packaging

Critical Metrology

for high yield


The Sirius-FW is a fourth generation, fully automated µXRF metrology platform that offers specialized single-bump metrology to monitor %Ag in SnAg solder bumps and under bump metalization. Its mature technology boasts a field proven uptime greater than 95%. The Sirius-FW system is capable of measuring single solder bumps as small as 10µm diameter with sub-micron positioning accuracy. Its automated intensity correction (AIC) ensures long-term stability and drift elimination. As would be expected for a production tool, the Sirius-FW is recipe driven and supports full fab automation. 

vertical excitation µXRF
Design configuration ideal for inline HVM metrology
<15 µm
small spot on AgKα
Results in low sensitivity to Z-errors
Fourth generation platfom with field-proven performance.

Key Features

  • µXRF with vertical excitation - optimized configuration for inline, HVM metrology
  • Small spot (<15 µm on AgKα)
  • Low sensitivity to Z-errors
  • Edge exclusion <0.5 mm
  • Non-destructive with low power sealed x-ray W tube
  • Polycapillary conditioning optics, polychromatic excitation
  • SDD detectors array for efficient photon collection
  • Quadrant collection reduces dependence on lateral errors, that is especially important when measure on a dome-shaped solder bumps
  • Support of highly bent substrates (up to 2mm bending), glass substrates

Instrumental for High Yield

Sirius-FW applications are instrumental for high yield:

  • %Ag in SnAg solder – key to control bumps reflow temperature, needed for regular bump shape and bonding
  • Solder bump height, metal thickness of UBM (under bump metallization), back bumps, RDL (redistribution layers) and pillars height: Cu, Ni, Au, Pd Ti – key to cross-wafer planarity needed for good bonding


  • Single bump metrology for process footprint determination
  • GR&R capable metrology on key applications
  • Production worthy productivity and MAM (move–acquire-measure) times: seconds for metal thickness, 30-60s for %Ag and bump height
  • TOR on major packaging fabs, proven stability and fleet matching


How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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