FilmTek 4000 Robotic
FilmTek 4000 Robotic
The FilmTek™ 4000 Robotic metrology system offers fully automated wafer metrology optimized for photonic integrated circuit manufacturing. This system offers several advances designed to enable optical component manufacturers to increase functional yield of their products, reliably and at lower cost.
Utilizing multi-angle reflectometry and patented multi-angle Differential Power Spectral Density analysis capability, the FilmTek 4000 delivers unmatched measurement accuracy required to meet waveguide manufacturing specifications. Measurement resolution is optimized through independent thickness and index (TE and TM modes) measurements of each cladding and core layer, with index measurement resolution up to 2×10-5. This provides a 100x performance advantage over the best non-contact method and 10x that of the best prism coupler contact systems.
System Components
Standard:
- Multi-angle, polarized spectroscopic reflection (400nm-1700nm)
- Measures film thickness and index of refraction independently
- 2×10-5 refractive index resolution
- Automated beam alignment
- Camera for imaging measurement location
- Cassette to cassette wafer handling
- FOUP and SMIF compatible
- Pattern recognition (Cognex)
- SECS/GEM
Optional:
- Spectroscopic ellipsometry with rotating compensator design (400nm-1700nm)
Patented FilmTek 4000 Methodology
FilmTek 4000 systems employ the patented Differential Power Spectral Density (DPSD) technique for high precision refractive index measurement. Spectroscopic reflection data are simultaneously gathered at fixed angles of incidence (0° & 70°) and the same measurement location. PSD processing results in two clear peaks in the Power Spectral Density domain. The ratio of the PSD peak positions is a function of the refractive index of the film and the angle of incidence of the oblique measurement. This ratio allows the refractive index to be calculated independently from thickness. Once the index is known, the thickness can be derived from the optical thickness of the normal incident peak.
Typical Application Areas
Silicon Photonics
Measure film thickness and refractive index with a 10x performance advantage over the best prism coupler contact systems.
Filmtek non-contact multi-angle reflectometry systems deliver precise high-resolution measurements and enable automated, in-line process control for a wide range of planar waveguide and silicon photonics applications (e.g., SiON, Si3N4, Ge-SiO2, P-SiO2, BPSG, APOX, HiPOX, and multi-layer SiO2/ SiON film stacks).
Technical Specifications
| Film Thickness Range | 0 Å to 250 µm (with SE option) |
|---|---|
| Film Thickness Accuracy | ±1.5 Å for NIST traceable standard oxide 5000 Å to 1 µm |
| Precision (1σ) | 5 µm Oxide (t,n): 2Å / 0.00002 |
| Spectral Range | 380 nm - 1700 nm (380 nm - 1000 nm is standard) |
| Measurement Spot Size | 1 mm (normal incidence); 2 mm (70°) |
| Spectral Resolution | Visible: 0.3 nm / NIR: 2 nm |
| Light Source | Regulated halogen lamp (10,000 hrs lifetime) |
| Detector Type | 2048 pixel linear CCD array / 512 pixel cooled InGaAs CCD array (NIR) |
| Automated Stage | 2000 mm or 300 mm |
| Computer | Multi-core processor with Windows™ 11 Operating System |
| Measurement Time | <5 sec per site (e.g., oxide film) |
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