High-resolution automated in-line X-ray inspection system
The X200 X-ray Imaging (XRI) system is on the leading edge of a new category of in-line transmissive inspection and metrology equipment. This one-of-a-kind, no-compromises platform for advanced packaging provides fully automatic 100% inspection and real-time feedback on the die-attach process.
As such, the high-speed, high-resolution X200 is the ideal defect inspection and production metrology solution for a wide range of semiconductor applications, from system-in-package (SiP) to 2.5D/3D integrated circuit (IC) integration.
With the X200, Bruker has optimized X-ray imaging to make full defect inspection feasible in-line on the manufacturing floor. Instead of pulling a small sample from the line for lengthy and data-limited 3D X-ray and cross-sectioning, 100% of production can be automatically monitored in real-time for maximal quality, reliability, and production yield.
Enables new levels of quality, reliability, and production yield.
The X200 is a one-of-its-kind solution. Its specialized design features Bruker-exclusive technology, such as our proprietary source-detector-sample architecture and proprietary transmissive architecture (with 1000 W source and high-resolution 30MP, 16-bit camera).
This unique design gives the X200 a unique set of capabilities, including:
The X200 system is specifically designed to increase efficiency and cost-effectiveness in both the measurement and analysis stages.
X200 is uniquely able to achieve full wafer surface scanning -- at high speed without any sacrifice of resolution. This enables a high through put, high accuracy 100% sampling strategy, thereby saving time during the measurement stage.
The X200 Data Analysis Toolkit completely eliminates the need for manual processing and interpretation of X-ray images. Its computer vision algorithms locate and analyze features of interest. Machine learning performs automatic defect classification and optimizes the pass/fail criteria to meet unique application specifications.
X200’s Data Analysis Toolkit provides:
Semiconductor applications require ever tighter tolerances, smaller interconnects, and more vertical layers. The X200's technology was developed to quickly and precisely identify small changes in device interconnect structures and to provide real-time feedback for process control and screening.
X200 is enabling semiconductor manufacturers to radically increase quality, reliability, and productivity.
Non-wet detection is vital to ensuring functionality of advanced processors.
In this example, X200 analysis showed both warpage and tilt contribute to a non-wet failure mode. When compared to manual X-ray inspection, the X200 achieved 100% accuracy and additionally flagged non-wet parts missed by operators.
Improper wetting leads to critical safety concerns for automotive microcontrollers.
In this example, X200 analysis showed that both warpage and tilt contribute to a non-wet failure mode. On ~300 microcontroller parts, X200 achieved 100% accuracy for non-wet detection and a precision-to-tolerance ratio <10%.
High-throughput and high-accuracy detection of non-wet defects is important for wireless chips.
In this example, the machine learning algorithms integrated into the X200 software helped to establish a fast and accurate process for non-wet detection using automatic defect classification (ADC). Using the X200 workflow, 100% of parts were accurately labeled as pass or fail based on non-wet defects, even including a non-wet part that was missed by manual X-ray labeling.
With increasing bump densities and demand for defect rates <100 ppb, it is critical to provide active feedback control on the die-attach process to minimize variations. By adopting a 100% sampling rate strategy, one can dramatically decrease the time it takes to discover an excursion from weeks to a couple days.
The X200 utilizes a unique, patented architecture optimized for high-speed inspection, which makes it 10 to 100 times faster than other X-ray tools for the same measurement capability. With advanced computer vision and AI, the process issues and defects are reported automatically.
Typical learning cycles in R&D depend on failure analysis labs, which take days to identify failures on a few parts. With X200, every part on the wafer can be analyzed within an hour to provide rich insights on the process issues. By reducing the learning cycle time, one can achieve faster time-to-market and maximize productivity over the product lifetime.
This depends on a variety of factors, including device complexity and cost of defects. Some possible considerations include:
Contact us to learn more about successful use-cases and suitable applications.
The following articles quoting Bruker XRI experts were published by Semiconductor Engineering:
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