X200

Improve process control systems with precise, real-time variation and defect feedback

High-resolution automated in-line X-Ray inspection (XRI) system

하이라이트

X200

On the leading edge of a new category of in-line transmissive inspection and metrology equipment, the X200 XRI system brings front-of-line semiconductor fab-like inspection to the backend manufacturing line. The system uses proprietary data collection architecture, industry-leading data processing, and innovative machine learning techniques to provide fully automatic, fast, 100% inspection and real-time feedback on user-defined regions of interest. Designed for continuous use on the manufacturing floor and able to inspect a range of semiconductor components—including singulated units, strips, boats, wafers, and film frames—the X200 provides the unique capabilities manufacturers need to meet increasingly stringent customer requirements and regulatory standards. The X200 XRI system is ideal for a range of semiconductor applications, from advanced packaging and system in a package (SiP) production to 2.5D and 3D integrated circuit chip (IC) integration and power component manufacturing.

 

Micron-scale
100% inspection and metrology
Enables new levels of quality, reliability, and production yield.
Real-time
analysis and detection of variation and defects
Acquires massive data sets at full resolution in seconds.
Leading-edge
machine learning algorithms and data processing
Provide previously unattainable precision for line control for critical attributes.

특징

Features

Unique Instrumentation for Advanced Semiconductor Defect Inspection

With advanced instrumentation and proprietary system architecture and processing techniques, X200 enables uniquely precise quantification, calculation, location, and interpretation of feature surface characteristics, defects, and variation.The system also provides comprehensive data and record management.

This is accomplished through:

  1. Full-field 2.8 µm pixel size.
  2. Collection of large field-of-view transmissive data at full resolution and with 16-bit data-rich images.
  3. Immediate feedback on critical attributes (solder joint quality, voids, bridges, and missing solder) for 100% of the desired regions of interest.
  4. Easy recipe setup with pre-configured data processing and reporting options.
  5. On-tool display, storage, and sharing for process trend and reject location data.

응용

Applications

Advanced Packaging

Advances in semiconductor packaging continue to enable higher performance in electronic components. With advanced packaging comes tighter tolerances, smaller interconnects, and more vertical layers. Together with increasingly stringent quality and reliability requirements from system manufacturers, these trends have exposed the limitations of existing inspection and metrology techniques.

The X200's technology was developed to quickly and precisely identify small changes in device interconnect structures and to provide real-time feedback for process control and screening.

Instead of pulling a small sample from your manufacturing line for lengthy and data-limited 3D X-ray and cross-sectioning, you can automatically monitor 100% of your production in real-time and achieve new levels of quality, reliability, and production yield.

System in a Package

The Internet of Things is putting complex electronic systems into products we interact with every day. While conventional surface-mount area array components are routinely 100% inspected with printed circuit board assembly (PCBA) XRI, these tools lack the resolution and sensitivity to inspect the smaller feature-size conductors in SiP.

However, Bruker’s X200 XRI technology allows high-speed 100% inspection and metrology at the micron scale. With high sensitivity and machine learning-based inspection algorithms, X200 automatically inspects SiP products to rapidly detect process variation and screen defects, such as non-wet solder joints, bridging, and voids.

2.5D/3D IC

Devices in artificial intelligence, high-speed networking, and other processing-intensive markets are moving to 2.5D and 3D package architecture to achieve high memory bandwidth and increased data transfer rates. Vertical integration compels manufacturers to use transmissive inspection techniques to monitor their processes, however, conventional point projection high-resolution X-ray lacks the speed and sensitivity to provide adequate in-line control.

X200’s algorithms acquire massive data sets in seconds with full resolution across the full field of view. Using advanced machine learning algorithms, thousands of solder joints are immediately characterized and evaluated. Detailed heat maps and intelligent outlier detection informs manufacturing process control and screens out defective interconnects.

Enhanced visualization of metrics across full die or wafer

Power Electronics

Quantification of die tilt angle based on solder deformation

Power electronics are proliferating rapidly in electric and autonomous vehicles. These systems are particularly intolerant to faults and defective components, yet the structure of power components (heat sinks, aluminum wire, solder die attach, etc.) make traditional transmissive inspection techniques difficult or impossible.

X200’s proprietary, high-power X-ray source technology has the sensitivity to collect rich data sets from power devices, and thus provide manufactures the ability to meet the most demanding automotive quality requirements.

부속품

Accessories

Analysis Toolkits

The X200 Data Analysis Toolkit revolutionizes the use of transmissive inspection technology in semiconductor packaging by eliminating manual processing and interpretation of X-ray images and letting image processing-based algorithms identify defective units.

X200’s proprietary analysis tools locate and analyze features of interest using machine learning techniques in real time as the system captures data from samples under test.

Supervised model learning can be accomplished on limited sample sizes to progress more quickly to production. With the addition of supervised learning from programmed defects or offline analyses, process control and reject detection criteria can be tuned to the user’s unique application specifications.

Analysis Toolkit

지원

Support

How Can We Help?

Bruker partners with our customers to solve real-world application issues. We develop next-generation technologies and help customers select the right system and accessories. This partnership continues through training and extended service, long after the tools are sold.

Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.

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