In this webinar, Dr. Pal-Jen Wei gives an overview of nanoindentation and nanoscratch characterization methods for thin films in the semiconductor industry.
Dr. Wei also provides specific examples in the following categories:
Advances in thin film deposition technologies and material development has enabled a wide range of industrial applications. Decreasing film thicknesses and material/manufacturing complexities pose increasing challenges for industrial engineers and process control in the evaluation of mechanical properties. Control of these ultra-thin films is extremely essential and presents a challenge in measuring mechanical properties with highly precise force, displacement, and positioning control.
This need to evaluate ultra-thin films has created a need for process grade metrology instrumentation with significantly enhanced precision in measuring a wide range of mechanical properties. Hardness, modulus, interfacial adhesion, fracture toughness, and temperature are just some of the mechanical property measurements that become significantly more difficult in thin films.
The webinar provides an overview of thin film characterizations applied in semiconductor industries using nanoindentation and nanoscratch techniques. Dr. Pal-Jen Wei introduces both the fundamental principles of the techniques and corresponding case studies.
Among the presented case studies are:
Throughout the webinar, Dr. Wei emphasizes the advantages of the nanoindentation and nanoscratch techniques for thin film characterization, especially due to their high spatial resolution and ability to perform direct measurements on wafer surfaces.
Find out more about the technology featured in this webinar or our other solutions for Thin Film Characterization:
Pal-Jen Wei, Ph.D.
Applications Scientist, Bruker