Ellipsometry and Reflectometry Systems

FilmTek 2000M

Spectroscopic reflectometry for thickness measurement of thin to very thick films on micron-sized device features

FilmTek 2000M

The FilmTek 2000M™ provides a measurement spot size as small as 1 x 2 µm and a nearly collimated beam. This approach allows accurate, non-contact measurement of thin to very thick films. With automated wafer handling, 1D/2D barcode scanner, and pattern recognition, straightforward measurements from an entire device wafer can be obtained, eliminating the need to infer broader performance from a limited sample area. 

Very thick film
sample compatibility
Enables accurate characterization of samples far outside the measurable thickness range of competing systems.
Micro-spot
optical design
Achieves small measurement spot sizes down to 2 μm.
Versatile
spectroscopic reflectometer
Enables measurement on a wide range of film types and thicknesses in many diverse application areas.
Learn more about this instrument.
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Features

Measurement Capabilities

Enables simultaneous determination of:

  • Multiple layer thicknesses
  • Indices of refraction [ n(λ) ]
  • Extinction (absorption) coefficients [ k(λ) ]
  • Energy band gap [ Eg ]
  • Critical dimension (CD) measurement

System Components

Standard:

  • Spectroscopic reflection measurement
  • 5nm to 350µm film thickness range
  • 2µm spot size (5×10µm standard)
  • Automated stage with autofocus
  • Camera for imaging measurement location
  • Pattern recognition
  • Advanced material modeling software
  • Bruker's generalized material model with advanced global optimization algorithms

Optional:

  • Automated wafer handling
  • SECS/GEM
Applications

Typical Application Areas

Medical Sensors & Devices

Enhance the quality, consistency, and performance of medical devices and sensors with accurate and robust thickness measurement of biologically active films.

FilmTek thin film metrology instruments enable automated non-contact measurement and whole-wafer mapping of film thickness for glucose sensors, coating thickness mapping on the surface of metal jaws, and film thickness determination for multi-layer stacks in single-use blood sensors.


Other typical application areas include:

  • Wafer/CD metrology
  • Compound semiconductor
  • Data storage
  • Flat panel display

Technical Specifications

Film Thickness Range5 nm to 350 µm (5 nm to 150 µm is standard)
Film Thickness Accuracy±1.5 Å for NIST traceable standard oxide 1000 Å to 1 µm
Spectral Range380 nm - 1700 nm (380 nm - 1000 nm is standard)
Measurement Spot Size2 µm (5x10 µm standard with 10x objective)
Sample Size2 mm - 300 mm (150 mm is standard)
Spectral Resolution0.3 - 2 nm
Light SourceRegulated halogen lamp (2,000 hrs lifetime)
Detector Type2048 pixel Sony linear CCD array / 512 pixel cooled Hamamatsu InGaAs CCD array (NIR)
ComputerMulti-core processor with Windows™ 10 Operating System
Measurement Time<1 sec per site (e.g., oxide film)

Performance Specifications

Film(s)ThicknessMeasured
Parameters
Precision ()
Oxide / Si500 - 1000 nmt0.025 nm
1 - 150 µmt0.005%
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