JVSENSUS-600F
JVSensus-600F
JVSensus-600F 是一款专为 300 mm硅基器件制造厂设计的 X 射线缺陷量测系统。该系统采用最新的 X 射线衍射成像（XRDI）技术，可助力识别晶圆生产制程中出现的各类问题。其应用场景包括监控晶圆边缘损伤，避免在超快速退火过程中因晶圆破裂造成的高额损失。此外，该系统能在各技术节点对制程设备进行检验与监控，不仅能缩短制程生产周期，还可为晶圆厂扩建提供支持。
晶体缺陷一键识别
JVSensus 使用户能在晶圆破裂发生前，精准定位潜在裂纹及其他结构性隐患，避免重大损失。一旦发现缺陷，可通过非破坏性横截面检测成像来确定缺陷在晶圆深度方向上的位置。
图形化晶圆的测量
可在无需样品制备的情况下，对空白晶圆、图案化晶圆和金属化晶圆进行测量。即使晶圆上有图案，也能轻松识别出缺陷，确保生产质量。
滑移检测
套刻问题的主要元凶是晶格滑移。无论是图形化晶圆、硅基氮化镓（GaN on Si）还是晶锭切片，JVSensus 都能在几分钟内完成滑移检测。
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