Bruker is dedicated to providing a complete range of high-performance metrology solutions for the nanometer-scale surface characterization of semiconductor materials and devices.
This workshop explores how our automated metrology solutions help streamline nanomechanical property sampling, processes ranging from nanoscale-to-microscale indentation to surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth characterization on the most current technology nodes and development of <3 nm tnodes.
ON-DEMAND RECORDING |00:03:33]
Welcome, everybody, and thank you so much for joining today's virtual workshop on the surface characterization of semiconductors. Our event today is brought to you by Bruker Nano Surfaces and Metrology division of North America. My name is Mike Berg, I'll be your host today, and I am the nanoindentation Product Specialist for the Bruker Hysitron business unit in Minneapolis.
We've got an exciting program today for everyone with a number of our applications experts joining to share about Bruker technologies and their applications, and to answer your questions.
Before we get started with the program, I wanted to bring up a few housekeeping items. Today's event is being recorded, so you will all be receiving a follow up email so you can view the on demand content afterwards. Feel free to share this with your colleagues or go back and rewatch sections of interest or that you may have missed.
We're encouraging you to submit your questions at any time during the talks. Each of our talks will have approximately 20 minutes, and then we'll reserve around five minutes for Q&A on each talk. You can submit your questions in the "Question" box of the GoToWebinar meeting dashboard, and for the questions we don't have time to address after each of the tal, we'll have an end-of-session Q&A in which we'll try to get to all of the questions. Otherwise, you can also write in directly by email after the event. You also have the flexibility to resize your webcam screen, as well as the presentation screen, so feel free to use those features.
Before we get to the agenda, I just wanted to also point out that we will be featuring a number of technologies from the Bruker Nano Surfaces product portfolio in the talks today, starting with the high resolution Dimension HPI atomic force microscope, then the Anasys nanoIR3 spectrometer, the Hysitron TI 980 nanoindenter for nanoindentation and no scratch, the Contour GTX optical profiler, the DektakXT stylus profiler, the TriboLab CMP tribometer, and, lastly, the Insight CAP HP automated AFM metrology tool.
So just a quick summary of our program today:
Discover how Bruker’s proven industrial metrology solutions enable materials scientists and engineers to gain a deeper understanding of the properties of semiconductor materials and their behavior at the nanoscale.
This program includes a combination of:
The information presented is ideal for researchers and engineers involved in R&D and the monitoring and improvement of manufacturing processes, as it addresses common questions posed by semiconductor researchers and engineers and provides insights into a variety of innovative and everyday characterization techniques in R&D and production in the fab.
To learn more about this event, the technology featured in it, or any of our products or solutions for the characterization of semiconductor materials, please contact us.
We will be happy to connect you with product and applications experts to discuss your unique needs.
*Please scroll down to view speaker information
John Thornton,
Senior Application Scientist, Bruker
Cassandra Phillips, Ph.D.
Application Scientist, Bruker
Douglas Stauffer, Ph.D.
Senior Manager of NI Applications Development
Sandip Basu, Ph.D.
Application Scientist, Bruker
Kora Farokhzadeh, Ph.D.
Application Scientist, Bruker
Ingo Schmitz, Ph.D.
Technical Marketing Engineer, Bruker