Ellipsometers and Reflectometers

FilmTek 3000 PAR

Combined reflection-transmission spectrophotometry optimized for highly absorbing patterned thin films

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FilmTek 3000 PAR

The FilmTek™ 3000 PAR augments our unique combined reflection-transmission spectrophotometer design to allow the characterization of patterned films deposited on transparent substrates, particularly very thin absorbing films like those used in optical antireflection coatings, laser mirrors, and thin metals, among many others.

 

In addition to full integration with our suite of advanced and proprietary material modeling software and optimization algorithms, this system utilizes our patented parabolic mirror technology to achieve a small spot size (down to 50 µm) and enhance its compatibility with patterned film samples. As a result, FilmTek 3000 PAR provides the same level of performance and data quality for patterned thin film characterization as the FilmTek 3000 provides for unpatterned film samples, making it easy for users to collect precise, simultaneous reflection and transmission measurements on challenging patterned film samples, even those that are highly absorbing in the DUV.

50 µm spot size
reflection-transmission measurements
Delivers improved accuracy on patterned films and for applications requiring small measurement pads.
Multimodal
single-instrument solution
Simultaneously provides reflection and transmission data.
Patented
optical configuration
Extends the capabilities of FilmTek's reflection-transmission spectrophotometry technology to include patterned samples.
Learn more about this instrument.
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Caractéristiques

Features

Measurement Capabilities

Enables simultaneous determination of:

  • Multiple layer thicknesses
  • Indices of refraction [ n(λ) ]
  • Extinction (absorption) coefficients [ k(λ) ]

 

  • Energy band gap [ Eg ]
  • Constituent, void fraction
  • Surface roughness

System Components

Standard:

  • DUV-NIR fiber-optic spectrophotometers
  • Spectroscopic reflection measurement
  • Spectroscopic transmission measurement
  • Automated stage with autofocus
  • Camera for imaging measurement location
  • 50 micron spot size
  • Pattern recognition
  • Advanced material modeling software
  • Bruker's generalized material model with advanced global optimization algorithms

Optional:

  • Automated sample handling

Applications

Applications

Typical Application Areas

Virtually all translucent films ranging in thickness from less than 100 Å to approximately 150 µm can be measured with high precision. Typical application areas include:

  • Photonics and telecom
  • Flat panel display

With flexible software that can be easily modified to satisfy unique customer requirements in  R&D and production environments.

Spécifications

Technical Specifications

Film Thickness Range 3 nm to 150 µm
Film Thickness Accuracy ±1.5 Å for NIST traceable standard oxide 1000 Å to 1 µm
Spectral Range 220 nm - 1700 nm (220 nm - 1000 nm is standard)
Measurement Spot Size 25 µm - 300 µm (50 µm standard)
Sample Size 50 mm - 300 mm (150 mm is standard)
Spectral Resolution 0.3 - 2 nm
Light Source Regulated deuterium-halogen lamp (2,000 hrs lifetime)
Detector Type 2048 pixel Sony linear CCD array / 512 pixel cooled Hamamatsu InGaAs CCD array (NIR)
Computer Multi-core processor with Windows™ 10 Operating System
Measurement Time <1 sec per site (e.g., oxide film)

Performance Specifications

Film(s) Thickness Measured Parameters Precision ()
Oxide / Si 200 - 500 Å t 0.5 Å
500 - 10,000 Å t 0.25 Å
1000 Å t , n 0.25 Å / 0.001
Nitride / Si 200 - 10,000 Å t 0.5 Å
Photoresist / Si 200 - 10,000 Å t 0.5 Å
a-Si / Oxide / Si 200 - 10,000 Å t 0.5 Å

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