The JVX7300LSI automated diffractometer is designed for in-fab R&D and in-line production process monitoring of semiconductor materials. It enables fully automated characterization of many advanced materials in the semiconductor industry. JVX7300L is the standard configuration, which comprises Scanning HRXRD, XRR, XRD, GI-XRD and WA-XRD for strain metrology, thin film and phase analysis on blanket wafers. Featuring fully automated source optics, the system can switch between standard XRD, High-Resolution, and X-ray reflectivity modes without user intervention, even within the same recipe batch. Full automation of the alignment, measurement, analysis and reporting of the results ensures productive and fast characterization of thin films.
The JVX7300LSI is utilized worldwide in advanced nodes logic and memory fabs.
Key applications are:
All applications are enabled by our comprehensive analytical software suite for analysis, simulation and fit: RADS and REFS.
For small spot measurements of test structures on patterned wafers, the S channel can be added, which has a spot size of 50µm x 50 µm at the sample. The channel can be either configured as a high resolution beam, for strain measurements with µHRXRD on epitaxial layers, or as a µXRD beam for phase, crystallinity and orientation measurements on crystalline films.
The S channel comes with fully automated pattern recognition.
Phase and orientation monitoring on ultra-thin crystalline films is enabled with the optional I channel for in-plane XRD measurements.
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Our highly trained team of support engineers, application scientists and subject-matter experts are wholly dedicated to maximizing your productivity with system service and upgrades, as well as application support and training.