三维光学轮廓仪

ContourX-100

性价比高的简约型台式粗糙度计量仪

亮点

ContourX-100

具备最高性价比的 ContourX-100 光学轮廓仪为精确的、可重复的、非接触式表面测量树立了新基准。该系统占地面积小,所采用的简化方案融合了布鲁克几十年的专利白光干涉(WLI)创新技术,具有强大的二维/三维高分辨测量能力。新一代增强功能包括全新的 5MP 摄像头和更新平台,实现更多缝合功能,并新增一个测量模式 USI,提升了精加工表面、厚膜和摩擦学应用测量时的便捷性和灵活性。ContourX-100 堪称性价比最高的台式系统。

业内最佳
Z向分辨率
提供不受放大率影响的一致的精准测量。
无与伦比
计量值
简化设计,不影响测量功能。
用户友好
软件界面
提供对大量预编程过滤器和分析程序的直接调用。
See the ContourX family brochure and ContourX-100 datasheet for more information.
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特点

特点

卓越计量能力

白光干涉所有物镜均提供恒定的最佳垂直分辨率。

ContourX-100 轮廓仪是布鲁克 40 多年来在非接触式表面计量、表征和成像领域专有光学创新和行业领导力的结晶。该系统利用三维 WLI 和二维成像技术,一次采集可执行多次分析。ContourX-100 在反射率 0.05% 到 100% 的所有表面情况下都能发挥稳定性能。

独一无二的价值和分析

ContourX-100 手动平台。

ContourX-100 台式可执行数千种自定义分析,并采用布鲁克简单而强大的 VisionXpress 和 Vision64 用户界面,提升了实验室和工厂的生产效率。软硬件的完美结合,实现简便操作下的高效率光学性能,全面超越同类计量技术。

应用

应用

Surface-Independent Metrology with Application-Specific Solutions

Precision Engineering

Keep the surface texture and geometric dimensions of precision-engineered parts within tight specification limits. Our gage-capable measurement systems provide efficient feedback and reporting as you monitor, track, and evaluate processes and assess GD&T conformance.

MEMS and Sensors

Perform high-throughput, highly repeatable etch depth, film thickness, step-height, and surface roughness measurements, as well as advanced critical dimension metrology of MEMS and optical MEMS. Optical profiling can characterize devices throughout the manufacturing process from wafer to final test, and even through transparent packaging.

Orthopedics/Ophthalmics

Obtain precise, repeatable measurements of implant materials and components through the complete product life cycle. Our WLI optical profilers support R&D, QA, and QC analyses, for applications ranging from characterization of surface parameters of lens and injection molds to surface finish verification and wear of medical devices.

Tribology

Measure, analyze, and control the impact of friction, wear, lubrication, and corrosion on material/component performance and lifespans. Determine quantitative wear parameters and perform fast pass/fail inspections on the widest range of shiny, smooth, or rough surfaces.

Semiconductors

Improve yield and reduce costs for both front- and back-end manufacturing processes with automated, non-contact, wafer-scale metrology systems. Perform post-CMP die flatness inspection; bump height, coplanarity, and defect identification and analysis; and measure the critical dimensions of component structures.

Optics

Better understand the root causes of defects and optimize polishing and finishing processes with accurate and repeatable sub-nm roughness measurements. Our non-contact metrology systems enable compliance with increasingly stringent specifications and ISO norms for samples ranging from small aspheric and free-form optics, to optical components with complex geometries, to diffraction gratings and microlenses.

网络研讨会

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