This webinar focuses on how advanced spectroscopic reflectometry and ellipsometry techniques serve process optimization, quality control and research for thin film-based devises such as medical sensor, MEMS, integrated circuit (IC) and semiconductor advanced packaging. An overview of these techniques will reveal how Bruker’s unique algorithms and hardware implementation alleviates common pitfalls, strengthens accuracy, and expands the measured film parameters to include porosity, composition, surface roughness, band gap energy, and film gradient. Use cases will be developed around medical devices, multi-layer film stacks for LED/front-end semiconductor and Through Silicon Via (TSV) for wafer level packaging/MEMS.
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Thin films are omnipresent in daily life and enable a wide range of applications including medical sensors, hard disk drives, opto-electronics, and integrated circuits (IC). Film measurement and quality control is mandatory during manufacture to ensure device functionality. Among several criteria, film thickness and refractive index are common physical parameters monitored for quality control (QC). Techniques for characterizing film thickness include indirect measurement of step height, created by masking a specific area where Atomic Force Microscopy (AFM) or Stylus/Optical profilers can achieve the desired vertical accuracy down to the sub-nanometer level. However, these contact methods require formation of a well-defined step and involve potential complicating issues related to material diffusion inside the masked region or spurious influences from stress induced surface curvature. Non-contact optical techniques such as reflectometry and ellipsometry provide a complementary approach for determining thickness and refractive index of single or multi-layer thin films and are well-suited for production environments.
This webinar aims to introduce the latest and most advanced spectroscopic reflectometry and ellipsometry techniques reflecting their respective accuracy and measurement range. An overview of these techniques will reveal how Bruker’s unique algorithms and hardware implementation alleviates common pitfalls, strengthens accuracy, and expands the measured film parameters to include porosity, composition, surface roughness, band gap energy, and film gradient. Use cases will be split into two main sections. The first will focus on medical devices and illustrate how accurate thin film thickness measurement can be performed on rough substrates. The second will be based on MEMS and semiconductor devices where multiple-angle reflectometry/ellipsometry measurements carry higher accuracy for multi-layer thin films and where unique collimated reflectometry provides a 300µm thickness range with sub-nanometer precision for Through Silicon Via (TSV), High Aspect Ratio trenches (HAR) and thick Photo-Resist (PR) applications.