3D Optical Profilometer


Fully automated benchtop for 3D metrology


Our Most Advanced Benchtop Design

  • Advanced automation configured with encoded XY stage, auto tip/tilt head, and auto intensity
  • Easy-to-use interface for quick, accurate results
  • Wide range of customizable automation features for unique and specialized measurement and analysis


The ContourX-500 Optical Profilometer is the world’s most comprehensive automated benchtop system for fast, non-contact 3D surface metrology. The gage-capable ContourX-500 boasts unmatched Z-axis resolution and accuracy, and provides all of the industry-recognized advantages of Bruker’s white light interferometry (WLI) floor-standing models in a much smaller footprint. The profiler is easily customized for the widest range of complex applications, from QA/QC metrology of precision machined surfaces and semiconductor processes to R&D characterization for ophthalmics and MEMS devices.

optical head
Measures surface features over a range of angles while minimizing tracking errors.
Most advanced
user interface
Provides intuitive access to an extensive library of pre-programmed filters and analyses.
air isolation
Provides best metrology precision in a space-efficient footprint.

Designed for Unmatched Benchtop Metrology

Bruker’s proprietary tip/tilt in the head provides unmatched user flexibility for production setup and inspection. By coupling the auto tip/tilt functionality with the optical path in the microscope head, Bruker has coupled the point of inspection to the line of sight independent of tilt. This results in less operator intervention provides the maximum reproducibility. Other hardware features include an innovative stage design for larger stitching capabilities and a 5MP camera with a 1200x1000 measurement array for lower noise, larger field-of-view, and higher lateral resolution. The combination of these features with automated staging and objectives makes the ContourX-500 ideally suited to “measure-on-demand” R&D and industrial metrology, all within a compact footprint.

Traditional pitch-and-roll stage designs require operator adjustment of five axes of motion to maintain point of inspection on line of sight for measurement. The unique Bruker tip/tilt in the head design maintains the line of sight on the point of inspection — regardless of tilt —resulting in optimized image acquisition and fastest time to data.

Streamlined Access to Extensive Analysis

Analysis of the bottom channel of a microfluidic device with direct extraction via Multiple Region from Vision64.

With thousands of customized analyses and Bruker’s simple-to-use, yet powerful VisionXpress™ and Vision64® user interfaces, the ContourX-500 is optimized for productivity in the lab and on the factory floor. Bruker’s new Universal Scanning Interferometry (USI) measurement mode provides fully automated, self-sensing surface texture, optimized signal processing while delivering the most accurate and realistic computation of the surface topography being analyzed. 


Surface-Independent Metrology with Application-Specific Solutions

Precision Engineering

Keep the surface texture and geometric dimensions of precision-engineered parts within tight specification limits. Our gage-capable measurement systems provide efficient feedback and reporting as you monitor, track, and evaluate processes and assess GD&T conformance.

MEMS and Sensors

Perform high-throughput, highly repeatable etch depth, film thickness, step-height, and surface roughness measurements, as well as advanced critical dimension metrology of MEMS and optical MEMS. Optical profiling can characterize devices throughout the manufacturing process from wafer to final test, and even through transparent packaging.


Obtain precise, repeatable measurements of implant materials and components through the complete product life cycle. Our WLI optical profilers support R&D, QA, and QC analyses, for applications ranging from characterization of surface parameters of lens and injection molds to surface finish verification and wear of medical devices.


Measure, analyze, and control the impact of friction, wear, lubrication, and corrosion on material/component performance and lifespans. Determine quantitative wear parameters and perform fast pass/fail inspections on the widest range of shiny, smooth, or rough surfaces.


Improve yield and reduce costs for both front- and back-end manufacturing processes with automated, non-contact, wafer-scale metrology systems. Perform post-CMP die flatness inspection; bump height, coplanarity, and defect identification and analysis; and measure the critical dimensions of component structures.


Better understand the root causes of defects and optimize polishing and finishing processes with accurate and repeatable sub-nm roughness measurements. Our non-contact metrology systems enable compliance with increasingly stringent specifications and ISO norms for samples ranging from small aspheric and free-form optics, to optical components with complex geometries, to diffraction gratings and microlenses.

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