三维光学轮廓仪

ContourX-500

ContourX家族的桌面旗舰型号,全自动设计,带编码器的样品台,头部倾斜设计,和AcuityXR实现高横向分辨率

ContourX-500

ContourX-500 光学轮廓仪是全球功能最全面的自动化台式系统,可快速完成非接触式三维表面计量。ContourX-500 具有卓越的 Z 轴分辨率和准确度,并具备布鲁克落地式白光干涉(WLI)仪器广受业界认可的所有优势,而占地面积更小。该款轮廓仪可轻松自主配置,适用于从精密加工表面和半导体工艺的质量保证/质量控制(QA/QC)计量到眼科和微机电系统(MEMS)器件的研发表征等广泛的复杂应用。

倾斜/俯仰
光学头
旋转测头进行不同角度测量表面特征时,将跟踪误差减至最低。
最先进
用户界面
提供对大量预编程过滤器和分析程序的直接调用。
集成式
气浮隔震
在紧凑空间内提供最佳计量精度。
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特点

专为卓越台式计量设计

布鲁克专有的光学头倾斜/俯仰技术,为用户生产设置和检测提供极大的灵活度。布鲁克将自动倾斜/俯仰功能与显微镜头中的光路相结合,实现了检测点与视线的结合,不受倾斜影响,从而减少操作人员的干预,提供最大可重现性。其他硬件功能包括创新工作台设计,可提升拼接能力;配备一只 5MP 摄像头,并采用 1200x1000 测量阵列,可降低噪声、扩大视场并提高横向分辨率。ContourX-500 将这些功能与自动化平台设置和物镜相融合,而且仅占较小的空间,成为“按需测量”研发和工业计量的理想系统。

传统的俯仰滚动工作台设计需要操作人员调整五个旋转轴,以将检测点保持在视线上进行测量。布鲁克独特的光学头倾斜/俯仰设计,不受倾斜影响,都能将视线保持在检测点上,从而优化图像采集,并大幅缩短数据获取时间。

直接使用多种分析

分析微流体器件的底部通道,通过 Vision64 的多个区域直接提取。

ContourX-500采用布鲁克简单而强大的 VisionXpress™ 和 Vision64® 用户界面,提供数千种自定义分析以提升实验室和工厂的效率。布鲁克全新通用扫描干涉(USI)测量模式可提供全自动、自感知式表面纹理、优化信号处理,同时对所分析的表面形貌执行最准确、最实际的计算。

应用

Surface-Independent Metrology with Application-Specific Solutions

Precision Engineering

Keep the surface texture and geometric dimensions of precision-engineered parts within tight specification limits. Our gage-capable measurement systems provide efficient feedback and reporting as you monitor, track, and evaluate processes and assess GD&T conformance.

MEMS and Sensors

Perform high-throughput, highly repeatable etch depth, film thickness, step-height, and surface roughness measurements, as well as advanced critical dimension metrology of MEMS and optical MEMS. Optical profiling can characterize devices throughout the manufacturing process from wafer to final test, and even through transparent packaging.

Orthopedics/Ophthalmics

Obtain precise, repeatable measurements of implant materials and components through the complete product life cycle. Our WLI optical profilers support R&D, QA, and QC analyses, for applications ranging from characterization of surface parameters of lens and injection molds to surface finish verification and wear of medical devices.

Tribology

Measure, analyze, and control the impact of friction, wear, lubrication, and corrosion on material/component performance and lifespans. Determine quantitative wear parameters and perform fast pass/fail inspections on the widest range of shiny, smooth, or rough surfaces.

Semiconductors

Improve yield and reduce costs for both front- and back-end manufacturing processes with automated, non-contact, wafer-scale metrology systems. Perform post-CMP die flatness inspection; bump height, coplanarity, and defect identification and analysis; and measure the critical dimensions of component structures.

Optics

Better understand the root causes of defects and optimize polishing and finishing processes with accurate and repeatable sub-nm roughness measurements. Our non-contact metrology systems enable compliance with increasingly stringent specifications and ISO norms for samples ranging from small aspheric and free-form optics, to optical components with complex geometries, to diffraction gratings and microlenses.

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