TriboLab CMP is a benchtop tribometer designed for CMP research, consumables evaluation, and process optimization. It enables cost-effective experimentation on small samples while offering continuous monitoring of friction, acoustic emission, temperature, and pad wear. By combining efficient process development and integrated real-time diagnostics, TriboLab CMP allows researchers and engineers to explore more process conditions while gaining greater visibility into polishing behavior.
To learn more, continue reading, contact us, see FAQs about this product, or download our Practical Guide to CMP Process Development and Characterization.
TriboLab CMP reproduces representative CMP process conditions on small samples and coupons without consuming production tool time.
TriboLab CMP provides direct visibility into polishing behavior through integrated in-situ measurements.
TriboLab CMP is designed to accommodate the diverse samples and consumables used in CMP development and characterization.
TriboLab CMP enables systematic studies through configurable recipes and automated process execution.
| Wafer Head | 1 to 500 rpm speed range; 0.29 to 29 psi range on 2 in wafer head; 0.07 to 7.2 psi range on 4 in wafer head; 4 to 400 N (0.9 to 90 psi) load range for other wafer sizes up to 4 in; <20 mN (0.004 lb) resolution |
|---|---|
| Platen | 1 to 500 rpm speed range; Up to 9 in (228 mm) platen size |
| Conditioner | 2 to 200 N (0.45 to 45 lb) load range; 10 mN (0.002 lb) resolution; Up to 4.25 in conditioning head size |
| Torque Capability | 5 Nm (3.7 ft-lb) @ 100 RPM, 2.5 Nm (1.8 ft-lb) @ 500 RPM |
| Temperature Measurement | Room temperature to 150°C |
| Acoustic Emmission Response | 0.2 to 5.0 MHz frequency response |
| Programmable Pump (optional) | Two computer-controlled pumps for feeding various slurries onto polishing pad; Two standard pump heads, 0.1 mL/min to 130 mL/min flow rate |
| Download the datasheet for full specs list | |
TriboLab CMP accommodates small coupons up to 100 mm (4”) wafers. Multiple wafer head and mounting options are available.
Wafer head and platen speeds for the TriboLab CMP system can range from 1 to 500 rpm. Polishing load ranges vary between 0.07 to 90 psi based on wafer size and head. Download the system brochure for a full list of specifications.
Yes. The system is designed for reliable, flexible, and cost-effective benchtop characterization that closely aligns with full-scale CMP conditions.
TriboLab CMP can use virtually any industry-standard pad, slurry, and conditioning disc. It also supports a programmable two-pump slurry and rinse delivery system.
Yes. The platform supports a wide range of materials. Bruker can advise on process parameters and connect you with partners for material-specific recipes when needed.
The system can record load, friction, temperature, acoustic emissions, speeds, and pressures from first contact to the end of the test.
TriboLab platforms support standard rotary, reciprocating, block-on-ring, four-ball, scratch, and indentation tests. Common methods include ASTM G99, G133, G77, D4172, and C1624. Equivalent ISO methods can typically be addressed through the same hardware and scripting.
The exact scope of the included installation and operator training depends on region and contract. Confirm details with your Bruker representative.
All TriboLab systems are modular. You can select drives, force and torque sensors, environmental chambers for temperature and humidity, liquid and electrochemical options, and advanced sensors to meet your application needs. If you are not sure which modules meet your needs, our experts can help.
Bruker provides applications consulting, troubleshooting, and best practice guidance, along with optional service plans for ongoing support, maintenance, and training.
Contact us to arrange a demonstration or submit samples for an evaluation tailored to your test geometry and materials.