Mechanical Tester

TriboLab CMP

R&D-scale process and material characterization system
TriboLab CMP

Najważniejsze informacje

TriboLab CMP

Leveraging over 20 years of CMP characterization expertise with its predecessor product (Bruker CP-4), TriboLab CMP brings a complete set of capabilities to the industry-leading TriboLab platform. The resulting accuracy and measurement repeatability enables the highly effective qualification, inspection, and ongoing functionality testing required throughout the CMP process. TriboLab CMP is the only process development tool on the market that can provide a broad range of polishing pressure (0.05-50 psi), speeds (1 to 500 rpm), friction, acoustic emissions, and surface temperature measurements for accurate and complete characterization of CMP processes and consumables.

Unmatched
ROI in a small-scale R&D system
This benchtop tool reproduces full-scale wafer polishing process conditions without downtime on production equipment.
Flexible
parameter control
Allows tailored testing to accelerate materials development and refine processes with accuracy.
Expert
applications and support
Our many years in working in partnership with a large install base delivers expertise to your lab.

Cechy charakterystyczne

Features

Small R&D-Scale Specialty System for CMP

Bruker’s TriboLab CMP Process and Material Characterization System has been designed from the ground up specifically for reliable, flexible, and cost-effective bench characterization of wafer polishing processes.
  • Reproduces full-scale wafer polishing process conditions without downtime on production equipment
  • Provides unmatched measurement repeatability and detail
  • Allows testing on small coupons for substantial cost savings over whole-wafer testing

On-Board Diagnostics for Better Understanding of Polishing Processes

Testing conditioning discs on the TriboLab CMP tester. Tests identify two groups of discs. Friction coefficient tests correlate with pad wear.
  • Delivers more visibility into transient polishing properties than any other system on the market
  • Collects data from the instant the substrate touches the pad and throughout the entire test
  • Enables early-stage process development decisions through more complete, detailed data

Flexibility in Sample Type, Size, and Mounting Configurations

  • Polishes any flat material, using virtually any conditioning disc, any slurry, and any pad
  • Accommodates small coupons through whole 100 mm wafers with ease
  • Accepts multiple sample mounts for flexibility
Schematic of CMP tester for conditioner pad tests.

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