On-Demand Sessions: Atomic Force Microscopy Methods for Semiconductor Failure Analysis
Identify AFM modes and methodologies that meet your failure analysis requirements
Characterizing Nanoscale Topography, Physical Properties, and Chemical Composition for Failure Analysis
PRESENTATION HIGHLIGHTS:
- [00:00:00] Introduction to AFM
- [00:01:22] Topographic Capabilities of AFM
- [00:14:50] Chemical characterization with AFM
- [00:19:30] Investigating thermal properties with AFM
- [00:21:12] Electrical modes
- [00:52:39] Mechanical characterization with AFM
- [00:55:21] Summary
Q&A
PRESENTATION HIGHLIGHTS:
- [00:00:00] When doing profiling, is the intent to look at the height or width of the trenches? How can you be sure you are getting to the bottom of the trenches? How do you remove any width effect from the probe?
- [00:03:34] How small of a defect can you detect in the review scan with the KLARF coordinates?
- [00:05:00] How long does it take to get chemical characterization data? How much time would it take to collect the map?
- [00:06:17] In reference to AFM-IR, would calcium components be a realistic target for identification?
- [00:07:50] In reference to conductive AFM, can tip contamination alter the IV curve?
