Complex large-scale, high-volume manufacturing environments require measurement methods for ensuring optimal process performance. Process metrology is utilized over the entire range of product commercialization activities - from the initial development of fabrication equipment to validating processing parameters and parameter limits to assuring the desired process output through continuous inline monitoring of product properties. Mechanical properties are directly tied to a material's structure and composition. Bruker's nanomechanical process metrology delivers valuable new insights into process variability and was specifically developed to assure processing parameters remain in a steady state.
Bruker is the pioneer in nanomechanical process metrology. Our Hysitron metrology equipment has been vital in successfully developing and implementing next-generation thin films and processes used in the semiconductor and MEMS industries. By providing high-resolution mechanical property measurements, fab engineers have been able to more quickly identify process variations that may degrade the functionality or reliability of the device being manufactured. Additionally, the interdependence of a material’s structure-processing-mechanical property relationships provides new insights into process variations that may be more challenging and more time consuming to identify through other means.
Interfacial adhesion has always been a slow to characterize and provided an average adhesion value over a relatively large area. Nanomechanical metrology can rapidly perform localized interfacial adhesion measurements on thin films without the need for sample preparation. These interfacial adhesion testing techniques assure consistency of thin film pre-deposition cleaning processes combined with the first atomic layer of material being deposited.
