Dektak XTL™ 探针式轮廓仪可容纳高达 350mm x 350mm 的样品,为大型晶圆和面板制造带来Dektak ®传奇的可重复性。Dektak XTL 具有空气振动隔离设计和全封闭工作站设计,具有易用的联锁门,是当今苛刻的生产车间环境的的理想之选。其双摄像头架构可增强空间感知能力,其高自动化水平可更大限度地提高测试通量。
增强的软件功能使 Dektak XTL 成为功能强大、容易使用的探针式轮廓仪。该系统利用 Vision64 软件,通过数百种内置分析工具实现众多的测量位点、3D成像和高度自定义的特征分析。Vision64软件还能测量形状,如曲率半径。模式识别可更大限度地减少操作员误差并提高测量位置精度。集成化的软件包将数据收集和分析与直观的工作流程相结合。
Dektak XTL 以 50 多年的探针式轮廓仪的专业知识和生产设施的应用程序定制为基础,以满足当今和未来严格的行业路线图。300 毫米高精度编码 XY样品台为制造商提供了满足严格计量研发要求的可靠工具。Dektak 的双摄像头控制与高清放大双视场相机提供增强的空间感知。实时视频中的点击定位使操作员能够快速将样品移动到正确的位置,以便快速轻松地进行测量设置和自动化编程。该系统的大型联锁门为样品装载/卸载提供了安全、方便的访问。
其他硬件功能包括:
Dektak XTL is designed for large-format and production-oriented measurements. It combines a motorized, high-accuracy encoded 300 mm XY stage, continuous 360° theta positioning, an enclosed workstation, integrated vibration isolation, and automation capabilities for process development and QA/QC environments.
Dektak XTL accommodates wafers up to 300 mm and samples up to 350 mm × 350 mm, with a maximum sample thickness of 50 mm. This supports both large wafers and panel or other large-substrate applications.
Dektak XTL uses dual-camera viewing with top and high-magnification side views. Operators can easily navigate to points of interest, orient the sample, and define scan start and end positions directly from the live video.
The encoded 300 mm XY stage and continuous theta positioning support automated measurements at unlimited measurement sites. Operators can program fiducials and measurement sites, while pattern recognition can improve measurement-location accuracy and reduce operator-to-operator variability. Measurement results can also be automatically analyzed and logged to a database.
Common applications include semiconductor wafers, touch panels, flat-panel displays, solar coatings, printed circuit boards, and flexible electronics. Measurements include deposited-film and resist step height, etch-rate determination, CMP erosion and dishing, coating thickness, and printed circuit board bumps and step heights.
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The sample is placed on a slider that slides over a highly polished flat glass block. The surface profile is measured by drawing the sample slider at constant speed underneath the stylus tip.
The vertical movement of the stylus tip is measured using LVDT (Linear Variable Differential Transformer) technology, which converts the stylus displacement into a highly precise and linear electrical signal.
Benchtop systems can accommodate small coupons up to full 8” wafers, while production models support large wafers and panels up to 12” size with encoded stages and multi‑site automation. The maximum sample height is 50 mm. Exact limits depend on the model, stage travel, and accessories.
For step height, typical vertical repeatability is on the order of a few angstroms to ~1 nm under controlled conditions, with sub‑nanometer repeatability possible on optimized setups and certified standards. Some key variables affecting accuracy and repeatability are tip condition/geometry, applied force, sample fixturing, vibration/thermal stability, and analysis procedures.
The standard stylus force of a Dektak stylus profiler ranges from 1 to 15 mg. For very delicate materials the force range can be extended downward to 0.03 mg (N-Lite force range).
The Dektak diamond stylus tips have a cono-spherical shape with radii ranging from 25 µm down to very sharp 50 nm. Often, Dektak stylus profilers are equipped with a stylus tip with 2 µm radius which is the recommended stylus radius for roughness measurements.
Sharper styli may be used if higher lateral resolution is required, while styli with greater radii may be useful on very sensitive surfaces.
Dektak styli are easily exchanged within a minute with the included stylus exchange tool. No tiny screwdrivers, Allen wrenches, or tweezers needed. No recalibration needed: Stylus exchange does not affect the calibration of the vertical scale, force scale or optical view.
Every Dektak stylus profiler supports recipe-based workflows for measurement and data analysis. In addition to measurement and automated analysis, Dektak recipes support the acquisition of sample information (e.g., wafer ID and part number), automatic saving of data files using template-generated filenames, and reporting of analysis results (e.g., step heights and roughness) to database tables.
Dektak stylus profilers with motorized XY-stage also allow to generate and run multi-site automation recipes, complete with wafer registration with alignment features (manual or by optical pattern recognition) and automated analysis and database reporting.
Lateral resolution is limited by tip radius, so choosing an appropriate tip is important. Steep slopes and narrow features can be misrepresented if the tip cannot access them fully. Very soft or tacky films may require minimal force and specific tips; in some cases, an optical profilometer may bebetter suited.
Bruker provides applications consulting, troubleshooting, and best practice guidance, along with optional service plans for ongoing support, maintenance, and training.
Contact us to arrange a demonstration or submit samples for an evaluation tailored to your test geometry and materials.
Bruker offers upgrade options for users of legacy Dektak systems. Contact us to discuss your current system, measurement requirements, and available options for moving to a current Dektak platform.