Virtual Event, Actual Science

Surface Characterization of Semiconductors: An Overview, from Topography to Advanced Physical Properties

Learn about Bruker’s high-performance metrology techniques for the nanometer-scale surface characterization of semiconductor materials and devices


Discover the most impactful innovations in semiconductor research.

This presentation focuses on Bruker’s solutions for nanometer-scale surface characterization of semiconductor materials and devices and the common questions and challenges facing scientists in this field. See real-time demonstrations of Bruker technology and the latest and most effective techniques available to semiconductor materials researchers.

Webinar Summary

Discover The Latest in High-Performance Surface Metrology

This workshop highlights how Bruker’s high-performance metrology techniques can provide new impulses for your research and assist in the nanometer-scale surface characterization of semiconductor materials and devices.

Our automated metrology solutions enable the streamlining of nanomechanical property sampling, from nanoscale-to-microscale indentation to surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth measurements on the most current technology nodes and wafers.

We demonstrate the capabilities of high-resolution, in-situ scanning probe microscopy (SPM) imaging, high-speed mechanical property mapping, and Optical (WLI) Profiling and Stylus Profiling to provide an in-depth explorationof material behavior at the nanoscale, ideal for R&D and the monitoring and improvement of manufacturing processes.

 

This webinar was presented on April 21, 2021.


Find out more about the technology featured in this webinar or our other solutions for surface characterization of semiconductor materials:

Speakers

Peter De Wolf, Ph.D., Director of Technology & Application Development

Peter De Wolf received his Ph.D in Electrical Engineering from the University Leuven, Belgium in 1998. His PhD work focused on the development of SPM based electrical characterization methods for semiconductors at IMEC in Belgium. He is co-inventor of several SPM methods & holder of several patents. Since 1998, Peter De Wolf works at Bruker (formerly Digital Instruments & Veeco Instruments) in both Santa Barbara, USA and Paris, France. At Bruker he held positions as R&D engineer and application development scientist.

Samuel Lesko, Ph.D.
Dir. of Technology and Apps Development for Tribology, Stylus & Optical Profilers, Bruker

 

Samuel Lesko has over 20 years of optical and stylus profiler applications experience, particularly in using white-light interferometry in a wide variety of fields, from MEMS and semiconductor to automotive and aerospace. He is a member of SME and part of ISO/TC 213/WG committee (areal roughness) and obtained his physics Ph.D. and material science engineering degree at the University of Burgundy in France.

Mickael Febvre, Ph.D.
Application Manager, Bruker EMEA

Udo Volz, Ph.D.
Applications Engineer, Bruker EMEA

Ude Hangen, Ph.D.
Applications Manager, Bruker EMEA

Vishal Panchal, Ph.D.
Sales Applications Scientist, Bruker EMEA

Hartmut Stadler, Ph.D.
Applications Engineer, Bruker Nano GmbH

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