Surface Characterization of Semiconductors: An Overview, from Topography to Advanced Physical Properties

Learn about Bruker’s high-performance metrology techniques for the nanometer-scale surface characterization of semiconductor materials and devices.

Watch On Demand

Discover the Most Impactful Innovations in Semiconductor Research Today

View this online lab session to see live demos and interesting talks about Bruker’s solutions for nanometer-scale surface characterization of semiconductor materials and devices.

This lab session includes:

  • Real-time demonstrations from our laboratories;
  • Detailed exploration of common questions and challenges facing scientists in this field; and
  • Expert-led discussions of the new and existing characterization techniques available to semiconductor materials researchers.

Discover The Latest in High-Performance Surface Metrology

Join us for this online lab session to see real-time, in-lab demos and interesting talks with Dr Peter De Wolf, Bruker's Worldwide Director of Applications, and his team.

This workshop highlights how Bruker’s high-performance metrology techniques can provide new impulses for your research and assist in the nanometer-scale surface characterization of semiconductor materials and devices.

Our automated metrology solutions enable the streamlining of nanomechanical property sampling, from nanoscale-to-microscale indentation to surface roughness measurement, chemical mechanical planarization (CMP), and etch-depth measurements on the most current technology nodes and wafers.

We demonstrate the capabilities of high-resolution, in-situ scanning probe microscopy (SPM) imaging, high-speed mechanical property mapping, and Optical (WLI) Profiling and Stylus Profiling to provide an in-depth explorationof material behavior at the nanoscale, ideal for R&D and the monitoring and improvement of manufacturing processes.


This workshop was recorded on: Wednesday, April 21st, 2021