半导体解决方案

• Ellipsometry and Reflectometry — Thin film metrology systems for wafer and CD metrology to meet requirements not measurable with conventional equipment
• Automated X-ray Metrology — Systems for high-quality process monitoring, detailed R&D analysis of epilayer films, identification of substrate defects, front-end-of-line control of epi films and high-k dielectrics, and analysis of metal films and wafer-level packaging bumps
• Automated Atomic Force Microscopy — Systems to reliably measure surface roughness, chemical mechanical planarization (CMP), and etch-depth features
• Photomask Repair — Systems to address the critical production issue of controlling pattern defects on high-end photomasks
• Cryo Dry Cleaning — Cryogenic CO₂ process equipment to remove contaminants and residues from wafers and electronic devices
• Surface Metrology — Topographic measurement and mechanical testing solutions for efficient process monitoring and control across the full range of applications
   

Bruker's suite of technologies for semiconductor manufacturing address critical metrology and process needs across the broadest range of applications from R&D to process improvement. 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation products. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition.